新闻来源：FiconTEC GmbH与阿米芯光

2022年6月6日，上海阿米芯光半导体有限公司（以下简称AMIchip)与FficonTEC GmbH签订战略合作协议，同意合作开发业界首个224G硅光子集成，旨在为业界提供下一代 800G/1.6T OEIC/CPO封装解决方案，随着全球范围内超大规模数据中心的持续建设，更节能的光电方案成为当今高性能应用的瓶颈，这次联合开发旨在以业界最高数据传输的速率下，以领先的低功耗效率和性能为行业提供可行的解决方案。

关于FiconTEC GmbH

FiconTEC是一家创新的高科技公司，在高度专业的市场中已迅速建立了自身的地位，公司总部设立在德国阿希姆，自2001年以来，随着不断的增长和创新发展，已在世界各地设立办事处，在光电子元器件和混合的光子器件的自动化组装、测试方面，是公认的市场领导者。

关于AMIchip

AMIchip是一家设计和销售用于数据中心、人工智能/机器深度学习、5G基础设施应用的硅光子和高性能集成电路产品的公司。 AMI chip 凭借独有的HBW-SiPh*硅基光电子技术，目前正在开发基于单波长224Gbps技术的800G/1.6T OEIC产品。

ficonTEC GmbH and AMIchip Amixinguang Collaborate on Next Generation Terabit OEIC/CPO Technologies

SHANGHAI, ACHIM(Germany) and SUZHOU, 2022/06/06 AMIchip and ficonTEC GmbH agreed on collaborating on industry's first 224G silicon photonic packaging development, aiming to provide the industry with next gen 800G/1.6T OEIC/CPO link solution. As hyperscale data centers continue to build worldwide, more energy efficient opto-electro links become bottleneck in today's high performance applications; this co-development aims to provide industry with a feasible solution at today’s highest data rate with leading energy efficiency and performance.

About ficonTEC

ficonTEC is an innovative high-tech company that has rapidly established itself in a highly-specialized market. With continued growth and innovative development since 2001, headquartered in Achim (Germany), with offices worldwide, ficonTEC is the recognized market leader when it comes to automated assembly and testing of opto-electronic components and (hybrid) photonic devices. 

About AMIchip

AMIchip design and market silicon photonics and high-performance integrated circuit products for Data Center, AI/ML and 5G infrastructure applications. With its proprietary HBW-SiPh* technology, AMIchip is currently developing 800G/1.6T OEIC products with 224G/lambda technology