Editing by Xin Lanhua
SMEE announced its new generation advanced packaging lithography machine with high resolution and wide visual field at a September 18 press conference in Shanghai. It will help packaging and test companies improve their crafts, contributing to the country’s IC industry growth.
SMEE (上海微电子装备集团) said its new machine would be used in high-density heterogeneous integration fields, with advantages of high resolution, high overlay precision, and super-wide exposure visual field. It can help wafer-grade advanced packaging enterprises realize the application of multi-chip, high density, and interconnected packaging technologies, fulfilling demands for applying heterogeneous integrated super chip packaging sizes.
So far, SMEE has reached sales agreements with many customers for the lithography machine, which will be delivered within 2021.
SMEE (Shanghai Micro Electronics Equipment (Group) Co., Ltd) was founded in 2002, specializing in semiconductor equipment and high-end intelligent equipment for use in IC fabs and advanced packaging of FPD panels, MEMS, LED, and power devices.
Certified by ISO 27001, ISO 9001, and ISO 14001, SMEE also provides primary/advanced training services on operation, calibration, maintenance for all SMEE products.
