灵明光子亮相德国 DVN 2026， 共话固态激光雷达与车载 3D 感知新趋势

2026年11月17-18日，第九届DVN Sensing & AD Applications Conference 将在德国斯图加特举行。灵明光子（Adaps）将参与本届大会，与全球汽车产业链伙伴共同探讨下一代车载感知技术的发展方向。

On November 17–18, 2026, the 9th DVN Sensing & AD Applications Conference will take place in Stuttgart, Germany. Adaps Photonics (Adaps) will join partners from across the global automotive industry to explore the future of next-generation vehicle sensing.

随着智能驾驶向更高阶演进，汽车感知系统正面临更高的性能、可靠性与集成度要求。如何通过底层芯片创新，推动激光雷达从复杂的机械扫描架构走向更高集成度的固态感知，成为行业持续关注的方向。

As intelligent driving advances, automotive perception systems face increasingly demanding requirements for performance, reliability, and integration. A key industry focus is how innovation at the semiconductor level can drive the transition from complex mechanical scanning systems toward more highly integrated solid-state LiDAR architectures.

本次大会期间，灵明光子将围绕 “The 22nm Leap: Redefining Solid-State LiDAR and Automotive 3D Sensing” 这一主题，分享以先进半导体工艺和 SPAD 阵列技术推动激光雷达面阵化、固态化的技术思考。

At the conference, Adaps will share its perspective in a presentation titled “The 22nm Leap: Redefining Solid-State LiDAR and Automotive 3D Sensing,” exploring how advanced semiconductor processes and SPAD array technology can accelerate the evolution toward array-based, solid-state LiDAR.

从像素阵列到芯片架构，从深度感知到系统集成，灵明光子持续探索高性能、低功耗、可规模化量产的 3D 感知解决方案，为下一代智能汽车提供更具竞争力的感知基础。

From pixel arrays and chip architectures to depth sensing and system integration, Adaps continues to develop high-performance, low-power 3D sensing solutions designed for scalable mass production, helping enable more capable perception systems for the next generation of intelligent vehicles.

以芯片创新推动感知进化

期待与全球行业伙伴相聚德国，共同交流固态激光雷达及汽车 3D 感知的未来。