Editing by Xin Lanhua
Foxconn Industrial Internet (FII) signed a strategic cooperation agreement with NXP Semiconductors in developing automotive smart cockpit in mid-December.
FII (Foxconn Industrial Internet Ltd.,工业富联) is the Shenzhen-based subsidiary of the Taiwanese Foxconn group, focusing on intelligent manufacturing services. The company was founded in 2015 and has been listed on the Shanghai Stock Exchange since 2018.
The signed cooperation is to develop in the initial stage a full digital cockpit based on NXP's i.MX 8 QuadMax. It will include a digital cluster, and a head-up display (HUD) system. They will enable leading global automotive OEMs and tier one automotive brands to deliver safe and comfortable in-vehicle experiences for customers. The project is scheduled to start volume production in 2023.
The two parties aim to expand the cooperation into UWB-based secure car access and safe automated driving through NXP's leading radar solutions.
Zheng Hongmeng, FII's CEO said, “FII is committed to providing clients with an automated, connected platform and big data-based technology, services, and solutions, to lead the application platform innovation across industries and fields continuously.”
Established in 2006 and headquartered in Eindhoven, Holland, the NXP Semiconductors is an active automotive IC provider in Asia and China.
Ron Martino, Executive Vice President for NXP Semiconductors, said, “NXP is very pleased to cooperate with FII. We look forward to a long-term strategic partnership, which will provide system-level solutions for achieving next-generation automotive innovation.”
